SPACEMIT

Key Stone K1 and K3

K3 runs 30B-parameter models on device. K1 is the world's most popular RISC-V AI CPU.

Key Stone K1 and K3 engineering comparison
Key Stone K1Key Stone K3
CPU config8 × X60, up to 2.0 GHz8 × X100 + 8 × A100, up to 2.4 GHz
Peak integer compute50K DMIPS130K DMIPS · over 9.0 SPECint2006/GHz per core
AI compute2.0 TOPS fused in the CPU cores60 TOPS INT4 · BF16 / FP16 / FP8 / INT8 / INT4
ISA profileRVA22 · RVV 1.0 256-bitRVA23 · RVV 1.0 1024-bit · Hypervisor + AIA + IOMMU
Process nodeTSMC 22 nmTSMC 12 nm
MemoryLPDDR4X 2400 MT/s · boards carry 8 to 16 GBLPDDR5 6400 MT/s · boards carry 16 to 32 GB
Video codecsHardware VPU decode · 4K playbackDecode 4K120 · encode 4K60
Target workloadsSBCs · robots · edge LLM terminals · NAS · industrial terminalsAI computers · embodied robots · personal and edge AI servers · LLM inference

Compute cores

One core line spans every chip above. Each generation doubles the integer throughput per gigahertz.

X60

Shipping in K1

The edge AI core: 8-core coherent clusters at 2 GHz on TSMC 22 nm, about 35% lower power than same-class rivals. The first 8-core RISC-V AI CPU in volume.

>3.5 SPEC2006/GHz · 2 GHz @ 22 nm

X100

Shipping in K3

The first RISC-V processor core with full virtualization support: 12-stage, 4-wide out-of-order, RVV 1.0 with vector crypto, proven in mass production.

>9 SPECint2006/GHz · 2.5 GHz @ 12 nm

X200

Development complete 2026 · production 2027

Optimized for AI inference: 14-stage, 6-wide out-of-order on TSMC 6 nm, with confidential computing, TSO, and coherent instruction cache. Not yet in a shipping kit.

>16 SPECint2006/GHz · 3.2 GHz @ 6 nm

Power Stone PMICs

The power half of the platform, built for the same boards.

P1

Multi-channel power management chip: 6 COT bucks, 12 LDOs, MTP NVM, with UVLO, OCP, OVP, and thermal shutdown. Ships with K1 on MUSE Paper.

P3

High-performance four-phase buck: 32 A sustained, 40 A peak, 91% peak efficiency, MTP-programmable timing, in a WLCSP 80-ball, 0.4 mm pitch package.

Compute IP

Licensed alongside the cores or already inside K3's virtualization and security blocks.

T100 IOMMU
Flexible integration for peripheral virtualization and acceleration.
AIA
An interrupt virtualization engine connecting devices and compute: up to 2047 MSI routes, 63 virtual-machine interrupt files, 1023 external interrupts at 256 priority levels.
IOPMP
A configurable foundation for high-performance bus security: Rapid-k model with 63 memory domains and 1024 entries, single-cycle latency on AXI4, ACE-Lite, and ACE5-Lite.

Software SDK

Two stacks, one runtime story: the silicon's capabilities exposed without bespoke kernel work.

AI Computer SDK

From a single board to a 48-chip cluster on one software stack.

  • Runs 30B-parameter models locally on K3
  • Standard CPU programming model, zero-cost migration
  • Bianbu Linux and OpenHarmony support built in
  • Hardware virtualization exposed end to end: CPU, memory, interrupts, IO

AI Robot SDK

Perception to actuation in one flow, on the robot's own silicon.

  • Complete ROS 2 support: Humble and Jazzy, open source
  • Independent real-time control domain with a dedicated interrupt and IO path
  • Multi-channel EtherCAT and CAN-FD interface options
  • Reinforcement-learning and multi-agent deployment, low-latency motion control

Ten official kits carry these chips, from an 85 × 56 mm board to a 2U cluster.

See the boards